Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

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Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC...

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CSP package substrate

5x5mm CSP package substrate

BT FCCSP Package Substrate

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