0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand...

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ENEPIG FCCSP package substrate

Buildup Types FCCSP package substrate

0.3mm FCCSP substrate

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