big capacity of memory packaging substrate manufacture

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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big capacity of memory packaging substrate manufacture

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big capacity of memory packaging substrate manufacture

Application:Flash memory pacakge,NAND memory substrate package,Memory electronics,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:0.1mm; Material ...

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SYTech BT SD Card PCB Board

Fast Turn SD Card PCB

0.1mm SD Card PCB

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